Empowered to lead critical resolution of operational needs for the Assembly process and equipment.
Optimize advance process control systems to detect signals and automate containment
Define maintenance procedures, engage and partner with technicians and manufacturing teams to maintain equipment meeting highest standards.
Discover and enable new breakthroughs process and equipment improvements.
Engage and lead new technology and product transfers and integration.
You should be in your 3rd or final year of a degree in Engineering or Computer Science or other related majors with an interest in AI and Machine Learning.
Strong English verbal and written communication skills.
Self-motivated, team-oriented individual with a strong data driven mindset and positive learning attitude.
Familiarity with semiconductor packaging and technologies would be an added advantage.
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